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U.S.: 1-800-LOCTITE (562-8483) Canada: 1-800-263-5043 na.henkel-adhesives.com/loctite www.equipment.loctite.com
Potting, Molding & Encapsulating
Design
Functional design allows for alternative solutions (simplified process vs. traditional technologies) Improved look and image
Process
Reduces total cost of ownership Low capital equipment costs and reduced footprint Increased throughput Low-viscosity materials allow for low injection pressures Less handling and shorter process time No cure process required
Products
Adhesion to multiple surfaces Complete watertight encapsulation Safe, 1-component, UL 94V-0 approved High temperature resistance Compliant materials suitable for sensitive electrical and telecommunication components
Sustainability
Zero waste All excess material and scrap are recyclable Natural ingredients
Low Pressure Molding
INSERT COMPONENTS OVERMOLD TEST MOLD HOUSING INSERT COMPONENTS DISPENSE AND ENCAPSULATE SETTLING OR VACUUM CURE TEST
Process Key Benefits
Low Pressure Process Flow
Through the combination of Product, Process and Design, Low Pressure Molding with TECHNOMELT delivers customers an advanced and environmentally sustainable solution to component protection.
Traditional Potting Process Flow
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